Jabil Precision Automation Solutions offers a full range of automated wafer handling systems. Based on our standardized wafer handling automation platforms -- WaferMate 300 and WaferMate 200 -- our systems are highly-configurable and …

We specialize in handling fragile wafers... The reason for choosing wafer-handling.com is when you need a handling tool that keeps 100% of your wafers from breakage, chipping and contamination. From thin warped wafer to compound wafer such as SiC, GaN, GaAs, we offer contact or non contact type handling tool for your special needs... Find out more

Our comprehensive range of vacuum wand components is designed to offer versatile configurations that cater to a wide array of wafer and die handling applications. Whether you're working with standard silicon wafers or complex compound material wafers like InP. SiC, GaAs, GaN or Ge, WHS has the perfect solution to meet your needs.

Reliable automated & manual wafer-handling tools such aligners, cassettes, vacuum wands, and other products.

G2’s RetiRacks™ line of products include automated and manual wafer transfer products, wafer flat finders, quartz boat handles, and more. These solutions are offered in many different variations and can be customized to meet special requirements.

Terra's microelectronics handling and testing tools include wafer scribers and pick-up kits, probe tips, PCB squeegee blades, liquid dispensers and wire bond testers. Click for full range of solutions!

GigaMat Technologies offers a variety of wafer sorting equipment that can sort based on multiple measurements, including thickness (optical or capacitance sensor), flatness (TTV), STIR, bow, warp, weight (for SiC), OCR, resistivity, and more.

Daitron Incorporated is the premier manufacturer and distributor of wafer beveling machines and wafer edge grinders. Click on the products below to learn more.

Feb 5, 2025 · Axus Technology can help you choose the right wafer grinding equipment to provide precise control, exacting dimensions, and challenging specification solutions. Precise wafer thickness control is critical in manufacturing integrated circuits, MEMS, LEDs, and Nanotechnology devices.

23-position automatic tool changer with 17 standard nozzle types; Tooling & Feeder Adaptability. With a handling area of up to 650 mm x 460 mm (25.6" x 18.1"), the WH389 can be configured for a wide range of applications. The system accommodates: Up to 160 Smart Tape and Stick Feeders; Wafer trays, gel packs, and waffle packs