Qualify 3-reticle Si interposer with thicker metal (5Mi), eDTC* and HBM2E in 2021 to further push for HPC. 100% success rate for STAR adopters in 2020. More flexible design options in 2021. Adoption rate to grow 4x in 2021. WoW Development: Logic-on-DTC (Deep Trench Capacitor). Demonstrated power droop reduction.

The adoption of chiplet integration through advanced packaging is considered a crucial technology for empowering AI applications which rely on large memory capacities integrated with the compute chip through dense and short interconnects enabling high-bandwidth at low power.

Feb 8, 2024 · Growing eco-system with applications calling for Advanced packaging & Die-to-Wafer hybrid bonding such as embedded systems for autonomous vehicle.

Oct 15, 2024 · Chiplets are a novel form of advanced silicon packaging—a highly modular design approach—that enables innovative specializations to be incorporated into future HPC chips. This could potentially help to regain some of the momentum from the halcyon days of HPC innovation.

Oct 20, 2022 · With a chiplet architecture, HPC architects can specify the bespoke hardware needs of their applications and pass those criteria off to the designers and the HPC vendors to get the best possible mix of compute, memory, and IO to support their workloads.

Mar 13, 2024 · AMD chiplet capabilities and advanced packaging allow AMD’s first-ever integration of data center class CPU, GPU accelerated compute, AMD Infinity Cache, and 8-stack HBM3 memory system into a single package.

Rather than build a single, monolithic system on chip (SOC), AMD proposes to leverage advanced die-stacking technologies to decompose the EHP into smaller components consisting of active interposers and chiplets. Each chiplet houses …

Chiplet concept is considered a promising approach to alleviate the pressure on performance, power, cost, yield, and time to market raising with the increasing complexity of the fore-mentioned technologies. In this paper, we like to discuss the challenges and opportunities to satisfy these demands in conjunction with chiplet techniques.

Apr 8, 2025 · Discover key HPC test challenges in the chiplet era from TestConX 2025. Learn about thermal management, KGD, interconnect reliability & test strategies from Tessolve.

Feb 4, 2025 · High-Performance Computing (HPC) Chiplet technology enables the integration in HPC of powerful processors memories and accelerators for the performance demanded on data-heavy tasks like simulations and scientific computations.