Jun 7, 2021 · Front opening unified pod platform with superior microenvironment control that provides clean and secure 300 mm wafer transport. Interested in Spectra™ FOUPs?

FOUP (an acronym for Front Opening Unified Pod [1] or Front Opening Universal Pod [2]) is a specialized plastic carrier designed to hold silicon wafers securely and safely in a controlled environment, and to allow the wafers to be transferred between machines for processing or …

The Spectra™ FOUP holds 300 mm wafers safely and securely while they are transported and transferred within the fab through hundreds of sophisticated process steps. Designed not only to address particles but to also minimize and control VOC, oxygen, and relative humidity (RH), our FOUPs provide superior

Aug 17, 2023 · FOSP is a front-opening shipping box used to transfer the wafer from the wafer fabrication unit to the semiconductor manufacturing unit. On the other hand, FOUP is a front-opening unified pod that stores and moves the wafer from one process to another in the semiconductor factory.

As the leading supplier of semiconductor- related wafer containers, Shin-Etsu Polymer maintains a large share of the 300mm front-opening shipping box (“FOSB”) and “FOUP” wafer container markets. Single molded structure to minimize cleaning drying cycle time, prevent particle generation and to maintain dimensional accuracy.

front opening unified pod (FOUP) that provides clean and secure wafer transport, optimum automation integration and the highest overall output for your facility

FOUP. Front opening unified pod platform with superior microenvironment control that provides clean and secure 300 mm wafer transport. Industry-proven door provides equipment interoperability and long life; Integral wafer supports give excellent wafer plane performance and reliable wafer access; ESD shell option provides added wafer protection

FOUPs are available in several colors, depending on the customers wish. FOUPs and IC manufacturing equipment can have a nitrogen atmosphere, in an effort to increase device yield. FOUP cleaner can improve yield by reducing FOUP contaminations.

A wafer FOUP is a specialized container designed to safely transport 300mm silicon wafers within automated material handling systems (AMHS). FOUP is specifically designed to accommodate 300mm wafers, which have become the standard in modern semiconductor manufacturing.

Jun 7, 2021 · Front opening unified pod (FOUP) platform with superior microenvironment control that provides clean and secure 300 mm wafer transport. 25- or 13-capacity FOUPs are available for thin, standard, and thick wafer substrates