Die arm 2 – 0118131 on TRUMPF Tooling USA | Well-suited for sheet thicknesses of 1.6 – 2 mm. Can be selected with die No. 1, 2, 2+, 3- or 3.

Quick Die Change System. The Die Arm features a one piece design and allows for ease of use. It can help operators to pull out or push in the die from the press bolster easily. There are 3 easy operative ways for storage when die arm is not used; which are …

The bolster extension makes it easy to move the dies to an accessible area of the press for convenient die changing with a crane or forklift truck. Available in three different designs: detachable RC series, drop-down RD series(alternate model), and folding RE/RF series.

May 1, 2023 · By C2C, or chip(let)-to-chip(let), we mean both chiplets (i.e. multi-die or die-to-die) and chip-to-chip (i.e. multi-chip through a PCB). CHI C2C targets advanced heterogeneous systems use cases, as well as Arm-based coherent SMP.

Use of serial flash allows Giga Devices to increase maximum flash size in their microcontrollers quite a bit (currently they have up to 3MiB) and to save quite a bit on ARM licensing fees (if they are paying "per die design"). Die has 110 pads, 9 of which are used by a flash die.

1200 Volt 13mOhm Silicon Carbide (SiC) MOSFET with customizable top metal back metals optimized for wire-bonding or sintering.

ARM®: Find the best ARM® Processor bare die for your design by registering to use our parameter drill-down search.

This webinar will showcase the design, analysis, and optimization of a multi-die fabric architecture based on the next generation Arm® CoreLink™ CMN-700 interconnect, a high-performance cache coherent interconnect solution designed for complex multi-die system-on-chip (SoC), such as those found in data centers.

ARM® Cortex®-M3 - EFM32GG900F1024: The EFM32GG900F512 32-bit Microcontroller in bare die form combines high integration, connectivity and memory needs with low-power. On-chip AES encryption, pulse counter, low-power UART & sensor interface deliver autonomous low …