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TSMC speeds up AI chip packaging expansion despite Nvidia's order cuts, targets future growth through collaboration with Intel
Despite rumors of reduced orders for advanced packaging capacities, Taiwan Semiconductor Manufacturing Company (TSMC) is ...
U.S. chip grants in limbo as Lutnick pushes bigger investments
Lutnick has signaled he could withhold promised Chips Act grants as he pushes companies in line for federal semiconductor ...
Samsung turns to China to boost its ailing semiconductor division
Samsung has turned to Chinese technology groups to prop up its ailing semiconductor division, as it struggles to secure big ...
Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels
High-accuracy packaging in panel level packaging ~ TOKYO, JP / ACCESS Newswire / March 27, 2025 / Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter "Toray ...
European coalition pushes for second Chips Act funding to boost semiconductor sector
A coalition of nine European Union countries, led by the Netherlands, has been formed to accelerate plans for a potential ...