The diagram in ... then connects to a GPU, CPU, TPU, or SoC die. The entire stack sits on an interposer atop a package substrate, similar to the packaging design used in HBM.
The H200 features 141GB of HBM3e and a 4.8 TB/s memory bandwidth, a substantial step up from Nvidia’s flagship H100 data center GPU. ‘The integration ... to ramp up the HBM capacity of its ...