As technology advances, engineers are finding new ways to build powerful microchips by stacking them on top of each ...

Atum Works claims its nanoscale 3D printing technology can cut chip production costs by 90% by replacing traditional ...

Based on 440BX chipset intended for mainstream PCs. Same as 810, but supports 133 MHz system bus and ATA-66. 810For value PCs. Includes integrated 3D graphics (AGP) with video out and hardware ...

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The chip tests cooling methods for stacked microelectronics by creating heat helping researchers manage overheating in 3D ...

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...

In addition, Cadence’s HBM4 test chip is pre-silicon-ready for tapeout, which is paving the way for CoWoS-L. The Cadence Integrity™ 3D-IC Platform now features enhanced support for improved ...

Together with TSMC, we’re pushing the boundaries of technology scaling, enabling next-generation advancements in chip design and packaging ... process and 3D stacking and packaging ...