EDA software is revolutionizing high-speed digital design by accelerating time-to-market despite growing complexity.

Complexity, uncertainty, and lots of moving pieces will challenge the semiconductor industry for years to come.

Chiplets can bring together different die technologies together in a single package to address AI/ML applications (see figure). This is already being done but in a proprietary fashion by large OEMs ...

Huawei unveils AI CloudMatrix 384 system based on 384 Ascend 910C processors that can beat Nvidia's GB200 NVL72 in ...

Transaction will augment Cadence’s expanding design IP portfolio and accelerate growth opportunities, reinforcing its ...

Alphawave IP Group reported record annual bookings for 2024 on Thursday, reflecting strong demand for its high-speed ...

Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly working with Nvidia to develop next-generation GPUs utilizing advanced chiplet technology. This collaboration is expected to play an ...

This webinar is an Electronic Design Member Exclusive Event. Please log in to view the video archive of our panel of EDA experts. You need to be logged in to view ...

CAMBRIDGE, Mass.--(BUSINESS WIRE)--HyperLight, the industry leader in thin-film lithium niobate (TFLN) technology, today announced the launch of its TFLN Chiplet™ platform, a modular and ...

Ayar Labs has unveiled the world’s first UCIe (Universal Chiplet Interconnect Express) optical interconnect chiplet. Designed to support AI workloads, Ayar Labs said the offering will eliminate ...

Introducing OPENEDGES’ Universal Chiplet Interconnect Express (UCIe) Controller IP, OUC, designed to transform the semiconductor landscape with innovative multi-chiplet designs. This UCIe chiplet ...