As chips get smaller and more powerful, keeping them cool becomes a serious bottleneck—until now. A research team from the ...

The approach uses lasers and holograms to detect misalignments as small as 0.017 nanometers. Researchers at the University of ...

Semiconductor chips have traditionally been manufactured in two dimensions. But as devices become more powerful and compact, ...

The integration of 3D printing in these fields is driving the development of next-generation devices with unprecedented ...

UMass Amherst researchers have developed a laser-based holographic alignment method that could revolutionize overlay accuracy ...

Researchers from Ritsumeikan University in Japan have demonstrated that commercially available 3D printing devices and ...

Previously, the two companies have achieved several breakthroughs, including the development of a new laser debonding process for producing 300 mm silicon chip wafers for 3D chip stacking technology.